Digital Marketing Company Names

Toshiba Expands Line-up of Ethernet Bridge ICs for Automotive Information Communications Systems and Industrial Equipment

Toshiba Expands Line-up of Ethernet Bridge ICs for Automotive Information Communications Systems and Industrial Equipment
Written by publishing team

Kawasaki, Japan – (work wire) – Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has added “TC9563XBG” to its family of Ethernet bridge ICs, to provide support for 10Gbps communications in automotive and industrial equipment information communication systems. Sample shipments have begun and volume production will begin in August 2022.

Vehicle networks are evolving towards engineering the region[1], where inter-area communication uses real time and multitasking[2] Transmission over Ethernet at a rate of 1 Gbps or higher. The new bridge IC has Toshiba’s first 2 10Gbps Ethernet port, the interface can be selected from USXGMII, XFI, SGMII, RGMII[3]. Supports two AVB Ethernet ports[4] and TSN[5], which facilitates real-time processing and simultaneous processing, respectively. It also supports “Simplified” SR-IOV (Default Functions)[6]. The combination of these features in the new product provides suitable solutions for the next generation of automotive networks.

As the speeds of communication devices continue to increase, the new IC can be used not only for area engineering but also for various automotive applications such as IVI, telematics and also in industrial equipment. It is also slated to be a successor to the existing TC9560 and TC9562 series products that support 1Gbps Ethernet.

In recent years, more and more devices are equipped with PCIe interfaces for device-to-device communications, such as Wi-Fi®, and the Host SoC tends to run PCIe interfaces. The TC9563XBG has three PCIe Gen 3 switch ports for connections with the Host SoC and for connection to devices with PCIe interfaces. The PCIe adapter portion is configured with one 4-lane host SoC and two 1-lane PCIe devices. Using the three-port PCIe switching function to connect to such devices can help alleviate the lack of a PCIe interface.

The TC9563XBG will be Class 3 of the AEC-Q100[7] I qualified.

Notes:

[1] Zone architecture: A network configuration expected to be used for automotive next-generation networks, in which a vehicle is divided into multiple zones that communicate with each other at high speeds for collaborative operation.

[2] Multi-gig: Multi-Gigabit Ethernet (2.5 Gbps to 10 Gbps). Modern automobile networks require bandwidth greater than 1 gigabit per second.

[3] USXGMII, XFI, SGMII, and RGMII: Standards for Ethernet Interfaces. USXGMII = 10Gb Universal Media Independent Interface; XFI = 10 gigabit serial interface; SGMII = Serial Gigabit Media Independent Interface; RGMII = Reduced Media Independent Gigabit Interface.

[4] Ethernet AVB: IEEE802.1 audio/video connection. A standard for processing audio and video data using the Ethernet standard.

[5] Ethernet TSN: IEEE802.1 time-sensitive networks. Standard for data transmission with lower latency than AVB.

[6] SR-IOV: Single-root virtual I/O. A standard that supports virtualization on PCI devices.

[7] AEC-Q100 Grade 3: Test standards formulated by the automotive industry to certify the reliability of integrated circuits.

Applications

  • Car infotainment

  • Automotive information technologies

  • car gates

  • industrial equipment

Features

  • Two 10Gbps Ethernet ports (selectable from USXGMII, XFI, SGMII, or RGMII)

  • 3 PCIe Gen3 switch ports

  • Be eligible for the AEC-Q100 Class III standard.

Key Specifications

piece number

TC9563XBG

CPU core

an arm® Cortex®-M3

HOST (external

Request)

interfaces

PCIe I/F: Gen3.0 (8GT/s) 3-Port Switch

Upstream: 1 port x 4 lanes

Downstream: 2 ports each x1 lane

Supports L0s, L1 and L1 PM substation low power states as power management

Simplified SR-IOV (default function) available

car fronts

Ethernet AVB, built-in MAC with TSN support (2 ports)

Supported interfaces are:

PortA: selectable from USXGMII, XFI, and SGMII

PortB: selectable from USXGMII, XFI, SGMII, RGMII

The connection speed is:

If USXGMII is specified: 2.5G / 5G / 10Gbps

If XFI is specified: 10M/100M/1000M/2.5G/5G/10Gbps

If SGMII is specified: 10M/100M/1000M/2.5Gbps

If RGMII is specified: 10M/100M/1000Mbps

Terminal interfaces

  • It can be selected from I2C or SPI

  • UART 1 channel

  • interrupt port

  • GPIO

current source

1.8V / 3.3V (IO) can be selected

1.8V (USXGMII / XFI / SGMII / RGMII)

1.8V (PCIe, PLL, OSC)

0.9V (Basic)

eviction

220 P-FBGA Ball, 10mm x 10mm, 0.65mm

See the URL below for more details on the new product.

TC9563XBG

See the URL below for more on Toshiba’s Automotive Ethernet Bridge Integrated Circuits.

Automotive Ethernet Bridge Relay Circuits

* Arm and Cortex are registered trademarks of Arm Limited (or its affiliates) in the United States and/or elsewhere.

* Wi-Fi is a registered trademark of the Wi-Fi Alliance.

* PCIe® and PCI Express® are registered trademarks of PCI-SIG Corporation.

* Other company names, product names, and service names may be trademarks of their respective companies.

Customer inquiries

MCU and Digital Devices Sales and Marketing Department.

call us

* The information in this document, including product prices, specifications, service content and contact information, is current on the date of the announcement but is subject to change without prior notice.

About Toshiba Electronics & Storage Company

Toshiba Electronic Devices & Storage Corporation, a leading supplier of advanced semiconductor and storage solutions, draws on more than half a century of experience and innovation to provide customers and business partners with discrete semiconductors, LSI systems, and HDD products.

The company’s 22,000 employees worldwide share a determination to maximize product value, and foster close cooperation with customers in co-creating new value and markets. With annual sales now exceeding 710 billion yen (6.5 billion US dollars), Toshiba Electronic Devices & Storage Corporation looks forward to building and contributing to a better future for people everywhere.

Find out more at https://toshiba.semicon-storage.com/ap-en/top.html

About the author

publishing team